Analog Integrated Circuit Device Data

4

Freescale Semiconductor

33784

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to Analog Ground (AGND) unless otherwise noted. Exceeding these ratings may cause a

malfunction or permanent damage to the device.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

I/O0, I/O1, I/O2, AN0, AN1, TEST1, TEST2, TOUT Voltage

V

I/On, ANn, TESTn, TOUT Pin Current

5.0

mA

BUSOUT Voltage, BUS SW = open

-14 to 40

V

BUSIN Voltage, BUS SW = open

-0.3 to 40

V

RTNOUT Voltage, BUS SW = open

-14 to 25

V

H_CAP Voltage

-0.3 to 40

V

BUSIN, BUSOUT, and H_CAP Current (Continuous)

400

mA

BUSIN, RTNIN, reverse current (max 5 ms)

400

mA

RTNIN, RTNOUT Current

400

mA

IDDQ Voltage

2.75

V

0.3 - 7.0

V

ESD Voltage(1)

Human Body Model (HBM)

Machine Model (MM)

Charge Device Model (CDM)

Corner pins

All other pins

±2000

±200

±750

±500

V

THERMAL RATINGS

Storage Temperature

-55 to 150

°C

Operating Ambient Temperature

-40 to 125

°C

Operating Junction Temperature

-40 to 150

°C

THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS

Resistance, Junction-to-Ambient (Single Layer (1s) PCB Board)

125

°C/W

Resistance, Junction-to-Board (Multi-Layer (2s2P) PCB Board)

62

°C/W

Peak Package Reflow Temperature During Reflow(2),(3)

Note 3

°C

Notes

1.

ESD1 testing is performed in accordance with the Human Body Model (HBM) (C

2.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

3.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.