SSL2101_4

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 04 — 28 August 2009

11 of 22

NXP Semiconductors

SSL2101

SMPS IC for dimmable LED lighting

[1]

Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k

Ω series resistor.

[2]

Machine model: equivalent to discharging a 200 pF capacitor through a 0.75

µH coil and a 10 Ω series

resistor.

[3]

Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each

pin down to 0 V over a 1

Ω resistor.

10. Thermal characteristics

The heat sink in the application with the SSL2101 is made with the copper on the

Printed-Circuit Board (PCB). The SSL2101 uses thermal leads (pins 4, 5, 13, 14 and 15)

for heat transfer from die to PCB.

Enhanced thermal lead connection may drastically reduce thermal resistance.

The following equation shows the relationship between the maximum allowable power

dissipation P and the thermal resistance from junction to ambient.

Where:

P = power dissipation

The thermal resistance as a function of the PCB area (Board: 0.8 mm thickness, 2 layers,

Bottom Cu coverage 90 %, Cu thickness 70

µm

(390 W/mK), Core material conductivity: 0.5 W/mK, 10 vias dia 0.3 mm) is shown in

Figure 8

electrostatic discharge voltage

human body

model;

[1]

Pins 16, 1, 2

−1000 +1000 V

All other pins

−2000 +2000 V

machine model

[2]

−200

+200

V

charged device

model

[3]

−500

+500

V

Table 4:

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured

driven. Pins ISENSE and AUX cannot be voltage driven.

Symbol

Parameter

Conditions

Min

Max

Unit

R

th j

a

–

()

T

j max

()

T

amb

–

() P

⁄

=