MCP631-ESLASHMF datasheet(39/42 Pages) MICROCHIP

39 / 42 page

DS22197A-page 39

MCP631/2/3/5

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

PART NO.

-X

/XX

Package

Temperature

Range

Device

Device:

MCP631

Single Op Amp

MCP631T

Single Op Amp (Tape and Reel)

(SOIC)

MCP632

Dual Op Amp

MCP632T

Dual Op Amp (Tape and Reel)

(DFN and SOIC)

MCP633

Single Op Amp with CS

MCP633T

Single Op Amp with CS (Tape and Reel)

(SOIC)

MCP635

Dual Op Amp with CS

MCP635T

Dual Op Amp with CS (Tape and Reel)

(DFN and MSOP)

Temperature Range: E

= -40°C to +125°C

Package:

MF = Plastic Dual Flat, No Lead (3×3 DFN),

8-lead, 10-lead

SN = Plastic Small Outline (3.90 mm), 8-lead

UN = Plastic Micro Small Outline (MSOP), 10-lead

Examples:

MCP631T-E/SN: Tape and Reel

Extended temperature,

8LD SOIC package

MCP632T-E/MF: Tape and Reel

Extended temperature,

8LD DFN package

MCP632T-E/SN: Tape and Reel

Extended temperature,

8LD SOIC package

MCP633T-E/SN: Tape and Reel

Extended temperature,

8LD SOIC package

MCP635T-E/MF: Tape and Reel

Extended temperature,

10LD DFN package

MCP635T-E/UN: Tape and Reel

Extended temperature,

10LD MSOP package

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