MCP14700 datasheet(6/26 Pages) MICROCHIP

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MCP14700

DS22201A-page 6

Switching Times

HIGHDR Rise Time

tRH

—10

—

CL = 3.3 nF, Note 1, Note 2

LOWDR Rise Time

tRL

—10

—

CL = 3.3 nF, Note 1, Note 2

HIGHDR Fall Time

tFH

—10

—

CL = 3.3 nF, Note 1, Note 2

LOWDR Fall Time

tFL

—6.0

—

CL = 3.3 nF, Note 1, Note 2

HIGHDR Turn-off Propagation

Delay

tPDLH

No Load, Note 1, Note 2

LOWDR Turn-off Propagation

Delay

tPDLL

No Load, Note 1, Note 2

HIGHDR Turn-on Propagation

Delay

tPDHH

No Load, Note 1, Note 2

LOWDR Turn-on Propagation

Delay

tPDHL

No Load, Note 1, Note 2

Protection Requirements

Thermal Shutdown

TSHDN

—147

—

°C

Note 1

Thermal Shutdown Hysteresis

TSHDN_HYS

—20

—

°C

Note 1

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VCC = 5.0V, TJ = -40°C to +125°C

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note 1:

Parameter ensured by characterization, not production tested.

See Figure 4-1 and Figure 4-2 for parameter definition.

TEMPERATURE CHARACTERISTICS

Unless otherwise noted, all parameters apply with VCC =5.0V

Parameter

Sym

Min

Typ

Max

Units

Comments

Temperature Ranges

Maximum Junction Temperature

—

+150

°C

Storage Temperature

-65

—

+150

°C

Specified Temperature Range

-40

—

+125

°C

Package Thermal Resistances

Thermal Resistance, 8L-3x3 DFN

—

°C/W

Typical Four-layer board with

vias to ground plane

—12—

°C/W

Thermal Resistance, 8L-SOIC

—163

—

°C/W

—42—

°C/W

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