• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macomtech.com for additional data sheets and product information.

M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make

changes to the product(s) or information contained herein without notice.

3

Flip Chip PIN Diode

RoHS Compliant

Rev. V4

MA4FCP305

ADVANCED:

Data Sheets contain information regarding a product M/A-COM Technology Solutions

is considering for development. Performance is based on target specifications, simulated results,

and/or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product M/A-COM Technology

Solutions has under development. Performance is based on engineering tests. Specifications are

typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

Handling Procedures

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin

oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.

Bulk handling should insure that abrasion and mechanical shock are minimized.

Bonding Techniques

These devices were designed for insertion onto hard or soft substrates with the junction side down. They can be

mounted with electrically conductive epoxy or with a low temperature solder preform. However,

Sn rich solders

are not recommended due to the tungsten metallization scheme beneath the gold contacts. Indalloy or

80/20, Au/Sn, solders are acceptable. Maximum soldering temperature must be < 300°C for < 10 sec. These

chips are designed to be inserted onto hard or soft substrates with the junction side down. They should be

mounted onto silkscreened circuits using electrically conductive Ag epoxy, approximately 1-2 mils in

thickness and cured at approximately 90°C to 150°C per manufacturer’s schedule. For extended cure times,

> 30 minutes, temperatures must be below 200 °C. The die can also be assembled with the junction side up,

and wire or ribbon bonds made to the pads.

Circuit Mounting Dimensions ( Inches )

Ordering Information

The MA4FCP305 flip chip diode may be ordered in either waffle packs, tape and reel or 6” rings mounted on

Part Number

Packaging

MA4FCP305

Die in Waffle Pack

MADP-007161-01269T

Tape & Reel

MADP-000305-12690R

Wafer on Tape Frame

0.012” (2) PL

0.008”

(2) PL

0.013”