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MAX16832A bảng dữ liệu(PDF) 2 Page - Maxim Integrated Products

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Giải thích chi tiết về linh kiện  2MHz, High-Brightness LED Drivers with Integrated MOSFET and High-Side Current Sense
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MAX16832A bảng dữ liệu(HTML) 2 Page - Maxim Integrated Products

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2MHz, High-Brightness LED Drivers with
Integrated MOSFET and High-Side Current Sense
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VIN = +24V, VDIM = VIN, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
IN, CS, LX, DIM to GND .........................................-0.3V to +70V
TEMP_I to GND .......................................................-0.3V to +6V
PGND to GND ......................................................-0.3V to +0.3V
CS to IN .................................................................-0.3V to +0.3V
Maximum Current into Any Pin
(except IN, LX, and PGND).............................................20mA
Continuous Power Dissipation (TA = +70°C)
8-Pin SO (derate 23.3mW/°C above +70°C)...........1860.5mW
Junction-to-Ambient Thermal Resistance (
θJA) (Note 1).....43°C/W
Operating Temperature Range
700mA (max) Output Current ........................-40°C to +125°C
1A (max) Output Current ...............................-40°C to +105°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Pin-to-Pin ESD Ratings......................................................±2.5kV
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Input Voltage Range
VIN
6.5
65
V
Ground Current
No switching
1.5
mA
Supply Current
VDIM < 0.6V, VIN = 12V
350
µA
UNDERVOLTAGE LOCKOUT (UVLO)
VCS = VIN - 100mV, VIN rising until VLX <
0.5VIN
6.25
6.5
Undervoltage Lockout
UVLO
VCS = VIN - 100mV, VIN falling until VLX >
0.5VIN
6.0
V
Undervoltage-Lockout Hysteresis
0.5
V
SENSE COMPARATOR
MAX16832A, VIN - VCS rising from 140mV
until VLX > 0.5VIN, VDIM = 5V
201
210
216
Sense Voltage Threshold High
VSNSHI
MAX16832C, VIN - VCS rising from 140mV
until VLX > 0.5VIN, VDIM = 5V
218
230
236
mV
MAX16832A, VIN - VCS falling from 260mV
until VLX < 0.5VIN , VDIM = 5V
185
190
198
Sense Voltage Threshold Low
VSNSLO
MAX16832C, VIN - VCS falling from 260mV
until VLX < 0.5VIN, VDIM = 5V
166
170
180
mV
Propagation Delay to Output High
tDPDH
Falling edge of VIN - VCS from 140mV to
260mV to VLX = 0.5VIN
50
ns
Propagation Delay to Output Low
tDPDL
Rising edge of VCS - VIN from 260mV to
140mV to VLX < 0.5VIN
50
ns
CS Input Current
ICSIN
VIN - VCS = 200mV, VIN = VCS
3.5
µA
INTERNAL MOSFET
VIN = VDIM = 24V, VCS = 23.9V,
ILX = 700mA
0.45
0.9
Drain-to-Source Resistance
RDSON
VIN = VDIM = 6.0V, VCS = 5.9V,
ILX = 700mA
12
Ω
LX Leakage Current
ILX_LEAK
VDIM = 0V, VLX = 65V
10
µA



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