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V•I Chip Voltage Transformation Module

V048F080T030

Rev. 2.2

Page 4 of 11

V•I Chip Voltage Transformation Module

Parameter

Min

Typ

Max

Unit

Note

Primary Control (PC)

DC voltage

4.8

5.0

5.2

Vdc

Module disable voltage

2.4

2.5

Vdc

Module enable voltage

2.5

2.6

Vdc

VC voltage must be applied when module is enabled using PC

Current limit

2.4

2.5

2.9

mA

Source only

Disable delay time

30

µs

PC low to Vout low

VTM Control (VC)

External boost voltage

12

14

19

Vdc

Required for VTM start up without PRM

External boost duration

10

ms

Vin > 26 Vdc. VC must be applied continuously

if Vin < 26 Vdc.

Figure 7 — 0-30 A load step with 100 µF input capacitance and no output

capacitance.

Figure 8 — 30-0 A load step with 100 µF input capacitance and no output

capacitance.

Parameter

Min

Typ

Max

Unit

Note

MTBF

MIL-HDBK-217F

3.5

Mhrs

25°C, GB

Isolation specifications

Voltage

2,250

Vdc

Input to output

Capacitance

3,000

pF

Input to output

Resistance

10

MΩ

Input to output

Agency approvals

cTÜVus

UL /CSA 60950-1, EN 60950-1

CE Mark

Low voltage directive

RoHS

Mechanical

See Mechanical Drawings, Figures 10 – 13

Weight

0.53/15

oz /g

Dimensions

Length

1.28/ 32,5

in / mm

Width

0.87 / 22

in / mm

Height

0.265/ 6,73

in / mm

Peak compressive force applied to case (Z axis)

5

6

lbs.

Supported by J-leads only

Thermal

Over temperature shutdown

125

130

135

°C

Junction temperature

Thermal capacity

9.3

Ws /°C

°C / W

°C / W

General