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STK15C88
Document Number: 001-50593 Rev. **
Page 13 of 15
Package Diagrams
Figure 11. 28-Pin (300 mil) SOIC (51-85026)
51 85127 *A
PIN 1 ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATING PLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
1
14
15
28
*
*
*
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
MIN.
MAX.
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.85gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85026-*D
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