TAS5630 datasheet(3/31 Pages) TI

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MODE SELECTION PINS

PACKAGE HEAT DISSIPATION RATINGS

(1)

TAS5630

www.ti.com ...................................................................................................................................................................................................... SLES220 – JUNE 2009

MODE PINS

OUTPUT

ANALOG INPUT

DESCRIPTION

CONFIGURATION

Differential

2 × BTL

AD mode

—

Reserved

Differential

2 × BTL

BD mode

Differential Single

1 × BTL +2 ×SE

BD mode, BTL Differential

Ended

Single Ended

4 × SE

AD mode

INPUT_C (1)

INPUT_D (1)

Differential

1 × PBTL

AD mode

BD mode

Reserved

(1)

INPUT_C and D are used to select between a subset of AD and BD mode operations in PBTL mode (1=VREG and 0=AGND).

PARAMETER

TAS5630PHD

TAS5630DKD

RθJC (°C/W) – 2 BTL or 4 SE channels

2.63

1.4

RθJC (°C/W) – 1 BTL or 2 SE channel(s)

4.13

2.04

RθJC (°C/W) – 1 SE channel

6.45

3.45

Pad Area (2)

64 mm2

80 mm2

(1)

JC is junction-to-case, CH is case-to-heat sink

(2)

RθCH is an important consideration. Assume a 2-mil thickness of thermal grease with a thermal conductivity of 2.5 W/mK between the

pad area and the heat sink and both channels active. The RθCH with this condition is 1.1°C/W for the PHD package and 0.44°C/W for

the DKD package.

ORDERING INFORMATION(1)

PACKAGE

DESCRIPTION

0°C–70°C

TAS5630PHD(2)

64 pin HTQFP

0°C–70°C

TAS5630DKD

44 pin PSOP3

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

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