RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de

YS

TEM C

ERTIF

IC

A

T

01

10123 - Rev B

DESCRIPTION

The CX3SM quartz crystals are leadless devices designed for

surface mounting on printed circuit boards or hybrid

substrates. They are hermetically sealed in a rugged,

miniature ceramic packages and are designed specifically for

manufacturing temperatures up to 260

FEATURES

Extensional mode

Ideal for use with microprocessors

Designed for low power applications

Compatible with hybrid or PC board packaging

Low aging

Full military testing available

Ideal for battery operated applications

Designed and manufactured in the USA

CX3SM CRYSTAL

800 kHz to 1.35 MHz

Low Profile Miniature Surface Mount Quartz Crystal

™

TYP.

MAX.

DIM

inches

mm

inches

mm

A

0.263

6.68

0.270

6.86

B

0.097

2.46

0.104

2.64

C

-

-

see below

D

0.052

1.32

0.058

1.47

E

0.030

0.76

0.035

0.89

DIM “C“”

GLASS LID

CERAMIC LID

MAX

inches

mm

inches

mm

SM1

0.053

1.35

0.067

1.70

SM2

0.055

1.40

0.069

1.75

SM3

0.058

1.47

0.072

1.83

A

B

E

D

D

TOP

BOTTOM

C

E

PACKAGE DIMENSIONS

SUGGESTED LAND PATTERN

C

0

C

1

R

1

2

1

L

1

EQUIVALENT CIRCUIT

R

L

C

C

0.070 (1.78)

0.210 (5.33)

0.110 (2.79)

inches (mm)

actual size

side view

Glass Lid Shown