TLC556, TLC556Y

DUAL LinCMOS

™ TIMERS

SLFS047B – FEBRUARY 1984 – REVISED SEPTEMBER 1997

3

POST OFFICE BOX 655303

TLC556Y chip information

These chips, properly assembled, display characteristics similar to the TLC556 (see electrical table). Thermal

compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted

with conductive epoxy or a gold-silicon preform.

OUT

DISCH

R1

R

S

1

RESET

CONT

VDD

THRESH

R

R

R

GND

TRIG

(3)

(5)

(1)

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJ max = 150°C

TOLERANCES ARE

±10%

ALL DIMENSIONS ARE IN MILS

NO BACKSIDE METALLIZATION

PIN (7) INTERNALLY CONNECTED

TO BACKSIDE OF CHIP

FUNCTIONAL BLOCK DIAGRAM (EACH TIMER)

(4)

(14)

(2)

(6)

(7)

61

97