AVAILABLE OPTIONS

PACKAGED DEVICES

CHIP

TA

VIOmax

AT 25

°C

SMALL

OUTLINE

(D008)

SMALL

OUTLINE

(D014)

CHIP

CARRIER

(FK)

CERAMIC

DIP

(J)

CERAMIC

DIP

(JG)

PLASTIC

DIP

(N)

PLASTIC

DIP

(P)

TSSOP

(PW)

FLAT

PACK

(U)

FLAT

PACK

(W)

CHIP

FORM

(Y)

15 mV

6 mV

3 mV

TL081CD

TL081ACD

TL081BCD

—

—

—

—

—

TL081CP

TL081ACP

TL081BCP

TL081CPW

—

—

—

0

°C

to

70

°C

15 mV

6 mV

3 mV

TL082CD

TL082ACD

TL082BCD

—

—

—

—

—

TL082CP

TL082ACP

TL082BCP

TL082CPW

—

—

TL082Y

15 mV

6 mV

3 mV

—

TL084CD

TL084ACD

TL084BCD

—

—

—

TL084CN

TL084ACN

TL084BCN

—

TL084CPW

—

—

TL084Y

–40

°C

to

85

°C

6 mV

6 mV

6 mV

TL081ID

TL082ID

TL084ID

TL084ID

—

—

—

TL084IN

TL081IP

TL082IP

—

—

—

—

–40

°C

to

125

°C

9 mV

—

TL084QD

—

—

—

—

—

—

—

—

—

–55

°C

to

125

°C

6 mV

6 mV

9 mV

—

—

TL081MFK

TL082MFK

TL084MFK

TL084MJ

TL081MJG

TL082MJG

—

—

—

TL081MU

TL082MU

TL084MW

—

The D package is available taped and reeled. Add R suffix to the device type (e.g., TL081CDR).