THS7002 datasheet(32/40 Pages) TI

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THS6002

DUAL DIFFERENTIAL LINE DRIVERS AND RECEIVERS

SLOS202D– JANUARY 1998– REVISED JULY 1999

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

PCB design considerations (continued)

Additional 4 vias outside of thermal pad area

but under the package

(Via diameter = 25 mils)

Thermal pad area (0.15 x 0.17) with 5 vias

(Via diameter = 13 mils)

Figure 57. PowerPad PCB Etch and Via Pattern

The actual thermal performance achieved with the THS6002 in its PowerPAD package depends on the

application. In the previous example, if the size of the internal ground plane is approximately 3 inches

× 3 inches,

then the expected thermal coefficient,

θJA, is about 21.5_C/W. For a given θJA, the maximum power dissipation

is shown in Figure 58 and is calculated by the following formula:

D +

MAX

–T

Where:

= Maximum power dissipation of THS6002 (watts)

TMAX = Absolute maximum junction temperature (150°C)

= Free-ambient air temperature (

°C)

θJA = θJC + θCA

θJC = Thermal coefficient from junction to case (0.37°C/W)

θCA = Thermal coefficient from case to ambient

More complete details of the PowerPAD installation process and thermal management techniques can be found

in the Texas Instruments Technical Brief,

PowerPAD Thermally Enhanced Package. This document can be

found at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be

ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.

THS7002 bảng dữ liệu(PDF) 32 Page - Texas Instruments