NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

04.07.2008

FERRITE CHIP BEADS

Z4 SERIES

9. SOLDERING AND MOUNTING :

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature (max)

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended.

Figure 1. Re-flow Soldering

Time(sec.)

60~150s

20~40s

Soldering

480s max.

60~180s

150

25

TP(260°C/10s max.)

217

200

Preheating

Note :

Within 10s

Gradual

Cooling

Over 2min.

Gradual

Cooling

cooling

Natural

Over 1min.

Figure 3. Hand Soldering

Preheating

350

150

330

3s

(max.)

10s

(max.)

Soldering

Figure 2. Wave Soldering

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 3 secs.

d) 1.0mm tip diameter (max)

cooling

Natural

cooling

150

245

260

Soldering

Preheating

Natural

4.40

products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering

seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to

Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature

9-1. Recommended PC Board Pattern

9-2.3 Soldering Iron (Figure 3) :

9-2.1 Lead Free Solder Re-flow :

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

Recommended temperature profiles for re-flow soldering in Figure 1.

is shown in Fig. 2

9-2.2 Solder Wave :

air soldering tools.

9-2. Soldering

2.20

under mechanical stress as warping the board.

the mechanical stress to prevent failure.

Products shall be positioned in the sideway direction against

PC board should be designed so that products are not sufficient