NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

03.07.2008

FERRITE CHIP BEADS

Z3 SERIES

9. SOLDERING AND MOUNTING :

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

Soldering

20~40s

60~150s

Time(sec.)

Figure 1. Re-flow Soldering

a soldering iron must be employed the following precautions are recommended.

c) Never contact the ceramic with the iron tip

b) 350°C tip temperature (max)

a) Preheat circuit and products to 150°C.

150

60~180s

480s max.

25

TP(260°C/10s max.)

200

217

Preheating

Note :

Over 2min.

Gradual

Cooling

Within 10s

Natural

cooling

Gradual

Cooling

Over 1min.

Figure 3. Hand Soldering

Preheating

330

150

350

3s

(max.)

10s

(max.)

Soldering

Figure 2. Wave Soldering

d) 1.0mm tip diameter (max)

f) Limit soldering time to 3 secs.

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

cooling

Natural

cooling

260

245

150

Soldering

Preheating

Natural

3.00

Recommended temperature profiles for re-flow soldering in Figure 1.

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

9-2.1 Lead Free Solder Re-flow :

9-2.3 Soldering Iron (Figure 3) :

9-1. Recommended PC Board Pattern

Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature

seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to

products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering

is shown in Fig. 2

air soldering tools.

9-2.2 Solder Wave :

9-2. Soldering

1.00

PC board should be designed so that products are not sufficient

Products shall be positioned in the sideway direction against

the mechanical stress to prevent failure.

under mechanical stress as warping the board.