NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

03.07.2008

FERRITE CHIP BEADS

Z1 SERIES

8. RELIABILITY & TEST CONDITION :

Bending

40(1.575)

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

Flexture Strength

100(3.937)

45(1.772)

right conditions.

45(1.772)

20(.787)

Solder a chip on a test substrate, bend the substrate

by 2mm (0.079in) and return.

TEST CONDITION

PERFORMANCE

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

More than 90% of the terminal electrode

Refer to standard electrical characteristics list

Appearance : No significant abnormality

10±0.5

seconds

60

seconds

Terminal Strength

Solderability

right conditions.

W

should be covered with solder.

60

seconds

Preheating

245°C

150°C

4±1.0

seconds

cooling

Dipping

Natural

Solder Heat Resistance

Temperature Rise Test

Electrical Characteristics Test

Rated Current

DC Resistance

Impedance

Preheating

Impedance change : Within ±30%

30°C max. ( t)

260°C

150°C

Dipping

cooling

Natural

For Z Series :

Force (Kfg)

1.0

4

8

7

6

5

2.0

1.5

1.0

1.0

3

2

1

Size

0.5

0.6

0.2

> 25

Time (sec)

Solder : Sn-Ag3.0-Cu0.5

Flux for lead free : rosin

Dip Time : 4±1sec.

Preheat : 150°C, 60sec.

Solder Temperature : 245±5°C

2. Temperature measured by digital surface thermometer.

Flux for lead free : rosin

Dip Time : 10±0.5sec.

Preheat : 150°C, 60sec.

Solder : Sn-Ag3.0-Cu0.5

Solder Temperature : 260±5°C

1. Applied the allowed DC current.

HP4291A, HP4287A+16092A

HP4338B

W

ITEM