SUPERWORLD ELECTRONICS (S) PTE LTD

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 4

05.05.2008

HIGH CURRENT POWER INDUCTORS

SDL1310 SERIES

Styrofoam

Inner box

Carton

Size

1800

360

SDL1310

180

a soldering iron must be employed the following precautions are recommended.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

Figure 2. Iron Soldering

Over 1min.

30~60s

Figure 1. Re-flow Soldering

cooling

Natural

230

60~120s

150

180

Preheating

250~260

Soldering

10s max.

260

150

Preheating

280

a) Preheat circuit and products to 150°C.

c) Never contact the ceramic with the iron tip

d) 1.0mm tip diameter (max)

f) Limit soldering time to 3 secs.

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

b) 280°C tip temperature (max)

Note :

Recommended temperature profiles for re-flow soldering in Figure 1.

8-2.2 Soldering Iron (Figure 2) :

air soldering tools.

8-2.1 Solder Re-flow :

8-2. Soldering

8. SOLDERIND AND MOUNTING :

8-1. Recommended PC Board Pattern ( Unit : mm )

Gradual

Cooling

Within 3secs.

Soldering

Natural

cooling

6.0±0.5

9. PACKING AND QUANTITY :