EP2C8 datasheet(4/7 Pages) ALTERA

4 / 7 page

DS-CYTHRML-3.0

Altera Corporation

Altera Device Package Information Data Sheet

Table 4 provides

θJA values and θJB (junction-to-board thermal resistance)

values for Cyclone III devices on a typical board.

U484

F324

F256

U256

Notes to Table 3:

(1)

Power layer Cu thickness 35 um, Cu 90%

(2)

Signal layer Cu thickness 17 um, Cu 15%

Table 3. PCB Dimensions Notes (1), (2)

(Part 2 of 2)

2.5 mm Thick Signal Layers

Power/Ground

Layers

Package

Dimensions

(mm)

Board

Dimensions

(mm)

Table 4. Thermal Resistance of Cyclone III Devices for Typical Board (Part 1 of 2)

Device

Package

θJA (°C/W)

Still Air

θJA (°C/W)

100 ft./min.

θJA (°C/W)

200 ft./min.

θJA (°C/W)

400 ft./min.

θJB (°C/W)

EP3C5

F256

32.2

27.9

25.5

23.6

17.3

U256

32.7

28.2

25.7

23.7

16.3

EP3C10

F256

32.2

27.9

25.5

23.6

17.3

U256

32.7

28.2

25.7

23.7

16.3

EP3C16

F256

28.4

24.2

21.8

13.5

U256

24.6

22.2

20.2

12.7

U484

26.3

22.1

19.9

18.1

12.4

F484

22.5

18.5

16.4

14.8

9.8

EP3C25

F256

27.5

23.2

20.9

19.1

12.6

U256

28.1

23.7

21.3

19.4

11.8

F324

26.4

22.3

20.1

18.3

12.4

EP3C40

F324

23.1

16.9

15.1

9.2

F484

22.3

18.2

14.3

8.5

U484

19.4

15.4

13.5

11.9

6.8

F780

17.6

13.9

12.1

10.7

6.7

EP3C55

U484

21.2

17.1

13.3

7.5

F484

18.6

14.6

12.6

11.1

F780

16.8

13.1

11.3

9.9

5.9

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