LTC4089/LTC4089-5

23

40895fb

Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However,

no responsibility is assumed for its use. Linear Technology Corporation makes no representation that

the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTIO

DJC Package

22-Lead Plastic DFN (6mm

3mm)

(Reference LTC DWG # 05-08-1714)

3.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)

IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON TOP AND BOTTOM OF PACKAGE

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. APPLY SOLDER MASK TO AREAS THAT

ARE NOT SOLDERED

3. DRAWING IS NOT TO SCALE

0.40

± 0.05

PIN #1 NOTCH

R0.30 TYP OR

0.25mm

× 45°

CHAMFER

BOTTOM VIEW—EXPOSED PAD

1.65

± 0.10

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.10

TYP

1

22

12

11

PIN 1

TOP MARK

(NOTE 6)

0.200 REF

0.00 – 0.05

(DJC) DFN 0605

6.00

±0.10

(2 SIDES)

0.25

± 0.05

0.889

0.889

0.50 BSC

5.35

± 0.10

(2 SIDES)

R = 0.10

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.65

±0.05

(2 SIDES)

2.20

±0.05

0.70

±0.05

3.60

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

0.50 BSC

5.35

± 0.05

(2 SIDES)

0.889

0.889