Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.

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SS-258 R6

KOA SPEER ELECTRONICS, INC.

Parameter

Requirement ∆ R

Test Method

Resistance to Solder Heat

± (1.0% + 0.005Ω)

MIL-R-55342 π 4.7.7, 260°C ± 5°C 10 ± 1 sec.

Solderability

95% coverage minimum

4.17 235°C ± 5°C 2 + 0.5 sec.

Terminal Strength Bend

± (1.0% + 0.005Ω)

5mm min. deflection in either direction for 10 sec.

Vibration

± (0.5% + 0.005Ω)

Each directions (3) for 2 hours

T.C.R.

Within specified

4.8 -55°C/+25°C/125°C

Short Time Overload

± (2.0% + 0.005Ω)

MIL-R-55342 π 4.7.5, 2.5 x RCWV for 5 sec.

Pulse

± (5.0% + 0.005Ω)

2.5 x RCWV, not exceeding maximum overload

voltage, 1 sec. ON, 25 sec. OFF, 10,000 cycles

Thermal Shock

± (1.0% + 0.005Ω)

4.19 -40°C (30 min.), +125°C ( 30 min.), 50 cycles

High Temperature

± (1.0% + 0.005Ω)

4.23 125°C ± 3°C, 1000 hrs

Exposure

Moisture Resistance

± (2.0% + 0.005Ω)

4.24 40°C ± 2°C 90 - 95% RH, 1000 hrs

Life

± (2.0% + 0.005Ω

4.25 70°C ± 3°C, 1000 hrs

6. Characteristics

7. Pad Dimensions

C

D

A

B

Soldering Pad

Chip Resistor

8. Packaging Specifications

8.1 Leader and End Tape

(Empty)

Top tape

15.75 (400)

1.97 (50)

7.87 (200)

(Empty)

Tape running direction

End Tape

(Top Tape)

Leader Tape

UR73

2A

2.0 X 1.25

1.3

3.1

1.25

0.9

2B

3.2 X 1.6

2.2

4.4

1.6

1.1

1E

1.0 X 0.5

0.5

1.8

0.5

0.65

1J

1.6 X 0.8

0.5

2.5

0.9

1.0

2A

2.0 X 1.25

0.8

3.4

1.3

1.3

2B

3.2 X 1.6

1.2

4.6

1.8

1.7

2H

(10m~30mΩ)

5.0 X 2.5

1.8

6.1

2.6

2.5

UR73D

2H

(33m~100mΩ)

5.0 X 2.5

3.3

6.1

2.5

1.4

3A

(10m~30mΩ)

6.4 X 3.2

2.3

8.0

3.3

1.7

3A

(33m~100mΩ)

6.4 X 3.2

4.6

8.0

3.0

1.7

Type

Style

Dimensions millimeters

Component Size

A

B

C

D