11

LTC1040

1040fa

PACKAGE DESCRIPTIO

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

J Package

18-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

OBSOLETE PACKAGE

J18 0801

.015 – .060

(0.380 – 1.520)

.100

(2.54)

BSC

.014 – .026

(0.360 – 0.660)

.045 – .065

(1.143 – 1.651)

.200

(5.080)

MAX

.125

(3.175)

MIN

.008 – .018

(0.203 – 0.457)

0

° – 15°

1

2

3

4

56

78

.220 – .310

(5.590 – 7.870)

.960

(24.384)

MAX

.005

(0.127)

MIN

16

13

9

10

11

12

14

15

17

18

.025

(0.635)

RAD TYP

.300 BSC

(7.62 BSC)

.045 – .065

(1.143 – 1.650)

FULL LEAD

OPTION

.023 – .045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

N Package

18-Lead PDIP (Narrow .300 Inch)

(Reference LTC DWG # 05-08-1510)

N18 1002

.020

(0.508)

MIN

.120

(3.048)

MIN

.130

± .005

(3.302

± 0.127)

.065

(1.651)

TYP

.045 – .065

(1.143 – 1.651)

.018

± .003

(0.457

± 0.076)

.005

(0.127)

MIN

.255

± .015*

(6.477

± 0.381)

.900*

(22.860)

MAX

18

12

3

4

56

7

8

9

10

11

12

13

14

16

15

17

.008 – .015

(0.203 – 0.381)

.300 – .325

(7.620 – 8.255)

.325

+.035

–.015

+0.889

–0.381

8.255

()

NOTE:

1. DIMENSIONS ARE

INCHES

MILLIMETERS

*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.

MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)

.100

(2.54)

BSC