eX Automotive Family FPGAs

ii

v3.2

Ordering Information

Plastic Device Resources

Speed Grade and Temperature Grade Matrix

Contact your local Actel representative for device availability.

Note: Automotive grade parts (A grade) devices are tested at room temperature to specifications that have been guard banded based on

characterization across the recommended operating conditions. A-grade parts are not tested at extended temperatures. If testing to

ensure guaranteed operation at extended temperatures is required, please contact your local Actel Sales office to discuss testing

options available.

eX128

TQ

Part Number

Package Type

TQ = Thin Quad Flat Pack (1.4mm pitch)

CS = Chip-Scale Package (0.8mm pitch)

100

A

Package Lead Count

Speed Grade

Application (Ambient Temperature Range)

A = Automotive (-40˚C to 125˚C)

64 Dedicated Flip-Flops (3,000 System Gates)

eX64

=

eX128

128 Dedicated Flip-Flops (6,000 System Gates)

=

eX256

256 Dedicated Flip-Flops (12,000 System Gates)

=

G

Lead-Free Packaging

Blank = Standard Packaging

G = RoHS Compliant Packaging

I = Industrial (-40˚C to 85˚C)

Blank = Commercial (0˚C to 70˚C)

Standard Speed

Blank=

P

Approximately 30% Faster than Standard

=

F

Approximately 40% Slower than Standard

=

Device

User I/Os (Including Clock Buffers)

64-Pin TQFP

100-Pin TQFP

49-Pin CSP

128-Pin CSP

180-Pin CSP

eX64

41

56

36

84

—

eX128

467036

100

—

eX256

—

81

—

100

132

Note: Package Definitions: TQFP = Thin Quad Flat Pack, CSP = Chip Scale Package

Std.

A

✓

Note: Refer to the eX Family FPGAs datasheet for more details on commercial-

and industrial-grade offerings.