3-6

TELCOM SEMICONDUCTOR, INC.

ABSOLUTE MAXIMUM RATINGS*

Forward Current .................................................... +10mA

Reverse Current .................................................... +30mA

Storage Temperature Range ................ – 65

°C to +150°C

Operating Temperature Range

TO-92 Package ..................................... 0

°C to +70°C

Surface Mount Package ........................ 0

°C to +70°C

Lead Temperature (Soldering, 10 sec)

TO-92 Package .............................................. +300

°C

Surface Mount Package ................................. +300

°C

Power Dissipation ............................. Limited by Forward/

Reverse Current

*Functional operation above the absolute maximum stress ratings is not

implied.

Symbol

Parameter

Test Conditions

Min

Typ

Max

Unit

Reverse Breakdown Voltage:

TC04

1.24

1.26

1.28

V

TC05

2.45

2.50

2.60

Reverse Breakdown Voltage Change:

TC04

15

—

10

20

mV

20

—

0.25

1

TC05

20

—

10

20

25

—

0.25

1

TC

Temperature Coefficient:

TC04A/TC05A

—

0.003

0.005

%/

°C

TC04B/TC05B

—

0.003

0.01

Reverse Current:

TC04

0.015

—

20

mA

TC05

0.020

—

20

LOW POWER, BANDGAP

VOLTAGE REFERENCES

TC04A

TC04B

TC05A

TC05B