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WH2001 bảng dữ liệu(PDF) 15 Page - Seoul Semiconductor

tên linh kiện WH2001
Giải thích chi tiết về linh kiện  Surface-mounted chip LED device
PDF  16 Pages
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nhà sản xuất  SEOUL [Seoul Semiconductor]
Trang chủ  http://www.seoulsemicon.com
Logo SEOUL - Seoul Semiconductor

WH2001 bảng dữ liệu(HTML) 15 Page - Seoul Semiconductor

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Document No. : SSC-QP-7-07-24 (Rev.00)
Rev. 00
Rev. 00
September 2008
September 2008
www.ZLED.com
www.ZLED.com
9. Soldering
10 sec. Max.
Soldering time
Condition
240℃ Max.
Peak-Temperature
120 sec.
Max.
Pre-heat time
120~150℃
Pre-heat
Lead Solder
10 sec. Max.
Soldering time
Condition
260℃ Max.
Peak-Temperature
120 sec.
Max.
Pre-heat time
150~200℃
Pre-heat
Lead Free Solder
260 C Max.
10 sec. Max.
o
60sec. Max.
Above 220 C
120sec. Max.
Pre-heating
150~200 C
1~5 C / sec.
o
o
o
o
1~5 C / sec.
Lead Solder
2.5~5 C / sec.
o
o
o
Pre-heating
120~150 C
120sec. Max.
60sec. Max.
Above 200 C
o
240 C Max.
10 sec. Max.
2.5~5 C / sec.
(1) Lead Solder
(2) Lead-Free Solder
Lead-frame Solder
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.



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