MPC5510 datasheet(27/54 Pages) FREESCALE

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Electrical Characteristics

MPC5510 Microcontroller Family Data Sheet, Rev. 2

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

2.5

Operating Current Specifications

Table 7. Operating Currents

Num

Characteristic

Symbol

Typ1

25C

Ambient

1 Typ - Nominal voltage levels and functional activity. Max - Maximum voltage levels and functional activity.

Typ1

70C

Ambient

Max1

-40–145C

Junction

Unit

Equations

ITOTAL = IDDE + IPP + IDDA + IDDR

IDDE = IDDE1 + IDDE2 + IDDE3

1VDDE(1,2,3) Current

VDDE(1,2,3) @ 3.0V - 5.5V

Static2, or when in SLEEP or STOP

Dynamic3

2 Static state of pins is when input pins are disabled or not being toggled and driven to a valid input level, output

pins are not toggling or driving against any current loads, and internal pull devices are disabled or not pulling

against any current loads.

3 Dynamic current from pins is application specific and depends on active pull devices, switching outputs, output

capacitive and current loads, and switching inputs. Refer to Table 8 for more information.

IDDE

Note 3

µA

2VPP Current

VPP @ 0V (All modes)

VPP @ 5.25V

SLEEP mode

STOP mode

RUN mode

IPP

µA

3VDDA Current

VDDA @ 4.5V - 5.25V

RUN mode4

SLEEP/STOP5 mode with 32KIRC

SLEEP/STOP5 mode with 32KOSC

SLEEP/STOP5 mode with 16MIRC

4 RUN mode is a typical application with the ADC, 16MIRC, 32KIRC running.

5 SLEEP/STOP mode means that only the listed peripherals are on. All others are diabled.

IDDA

111

165

225

µA

4VDDR Current

VDDR@ 4.5V - 5.25V

SLEEP mode

STOP mode

RUN mode (Using 16 MHz IRC)

RUN mode (Maximum @ 48 MHz)6

RUN mode (Maximum @ 66 MHz)7

RUN mode (Maximum @ 80MHz)8

Optional: RTC/API (SLEEP mode)

Optional: Each 8K RAM block (SLEEP mode)

Optional: XOSC (SLEEP and STOP mode)9

6 RUN mode condition includes PLL selected as source of system clock, XOSC enabled with 40MHz crystal, all

peripherals enabled, both cores running, and running a typical application using both SRAM and flash.

7 RUN mode condition includes PLL selected as source of system clock, XOSC enabled with 40MHz crystal; all

peripheral and cores enabled and running a typical application using both SRAM and flash. Be sure to calculate

the junction temperature, as the maximum current at maximum ambient temperature can exceed the maximum

junction temperature.

IDDR

170

105

120

0.8

500

600

110

130

600

360

4200

120

135

900

µA

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