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MP3V5004DP bảng dữ liệu(PDF) 4 Page - Freescale Semiconductor, Inc

tên linh kiện MP3V5004DP
Giải thích chi tiết về linh kiện  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  14 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MP3V5004DP bảng dữ liệu(HTML) 4 Page - Freescale Semiconductor, Inc

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Sensors
4
Freescale Semiconductor
MP3V5004G
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE
MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
Figure 5. SOP Footprint (Case 482)
Part Number
Case Type
Pressure (P1) Side Identifier
MP3V5004GC6U/T1
482A
Side with Port Attached
MP3V5004GC7U
482C
Side with Port Attached
MP3V5004GP
1369
Side with Port Attached
MP3V5004DP
1351
Side with Port Marking
MP3V5004GVP
1368
Stainless Steel Cap
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
inch
mm
SCALE 2:1



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