AD9522-2 datasheet(16/84 Pages) AD

16 / 84 page

AD9522-2

Rev. 0 | Page 16 of 84

ABSOLUTE MAXIMUM RATINGS

Table 19.

Parameter or Pin

With

Respect to

Rating

GND

−0.3 V to +3.6 V

VCP, CP

GND

−0.3 V to +5.8 V

REFIN, REFIN

GND

−0.3 V to VS + 0.3 V

RSET, LF, BYPASS

GND

−0.3 V to VS + 0.3 V

CPRSET

GND

−0.3 V to VS + 0.3 V

CLK, CLK

GND

−0.3 V to VS + 0.3 V

CLK

−1.2 V to +1.2 V

SCLK/SCL, SDIO/SDA, SDO, CS

GND

−0.3 V to VS + 0.3 V

OUT0, OUT0, OUT1, OUT1,

OUT2, OUT2, OUT3, OUT3,

OUT4, OUT4, OUT5, OUT5,

OUT6, OUT6, OUT7, OUT7,

OUT8, OUT8, OUT9, OUT9,

OUT10, OUT10, OUT11, OUT11

GND

−0.3 V to VS + 0.3 V

SYNC, RESET, PD

GND

−0.3 V to VS + 0.3 V

REFMON, STATUS, LD

GND

−0.3 V to VS + 0.3 V

SP0, SP1, EEPROM

GND

−0.3 V to VS + 0.3 V

Junction Temperature1

150°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (10 sec)

300°C

1 See Table 20 for θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Thermal impedance measurements were taken on a JEDEC

JESD51-5 2S2P test board in still air in accordance with JEDEC

JESD51-2. See the Thermal Performance section for more details.

Table 20.

Package Type

θJA

Unit

64-Lead LFCSP (CP-64-4)

°C/W

ESD CAUTION

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