AD5522JSVDZ datasheet(15/60 Pages) AD

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AD5522

Rev. A | Page 15 of

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 4.

Parameter

Rating

Thermal resistance values are specified for the worst-case

conditions, that is, a device soldered in a circuit board for

surface-mount packages.

Supply Voltage, AVDD to AVSS

34 V

AVDD to AGND

−0.3 V to +34 V

AVSS to AGND

+0.3 V to −34 V

Table 5. Thermal Resistance1 (JEDEC 4-Layer (1S2P) Board)

Package Type

Airflow

(LFPM)

θJA

θJC

VREF to AGND

−0.3 V to +7 V

DUTGND to AGND

AVDD + 0.3 V to AVSS − 0.3 V

Unit

REFGND to AGND

AVDD + 0.3 V to AVSS − 0.3 V

TQFP Exposed Pad Down

4.8

°C/W

DVCC to DGND

−0.3 V to +7 V

No Heat Sink2

22.3

°C/W

AGND to DGND

−0.3 V to +0.3 V

200

17.2

°C/W

Digital Inputs to DGND

−0.3 V to DVCC + 0.3 V

500

15.1

°C/W

Analog Inputs to AGND

AVSS − 0.3 V to AVDD + 0.3 V

With Cooling Plate at 45°C3

N/A

5.4

4.8

°C/W

Storage Temperature Range

−65°C to +125°C

TQFP Exposed Pad Up

°C/W

25°C to 90°C

Operating Junction Temperature

Range (J Version)

No Heat Sink2

42.4

°C/W

200

37.2

°C/W

Reflow Soldering

JEDEC Standard (J-STD-020)

500

35.7

°C/W

Junction Temperature

150°C max

With Cooling Plate at 45°C3

N/A4

3.0

°C/W

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

1 The information in this section is based on simulated thermal information.

2 These values apply to the package with no heat sink attached. The actual

thermal performance of the package depends on the attached heat sink and

environmental conditions.

3 Natural convection at 55°C ambient. Assumes perfect thermal contact

between the cooling plate and the exposed paddle.

3 N/A means not applicable.

ESD CAUTION

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