Dual Value Chip Resistors, Center Tap

RMK 33N

Vishay Sfernice

www.vishay.com

For technical questions, contact: sfer@vishay.com

Document Number: 60068

28

Revision: 06-Oct-08

The demand for high precision, high stability microchips for

both military and industrial environments is increasing with

the growth and sophistication of modern day hybrid circuitry.

The need for high accuracy ultra stable micro dividers

particularly triggered the development of these third

generation nickel chromium microchip dividers which offer

standards of accuracy and thermal/time stability never

achieved before in the conventional second generation thin

metal film technologies.

FEATURES

• High precision

• Very low temperature coefficient < 10 ppm/°C

• Excellent stability 0.03 % (2000 h, rated power,

at + 70 °C)

• Wirebondable

TYPICAL PERFORMANCE

SCHEMATICS

(Unequal values on request)

Note:

* Please see document “Vishay Green and Halogen-Free Definitions (5-2008)” http://www.vishay.com/doc?99902

Actual Size

ABS

TRACKING

TCR

5 ppm/°C

1 ppm/°C

ABS

RATIO

TOL.

0.1 %

0.01 %

R

1

R

2

R

T

STANDARD ELECTRICAL SPECIFICATIONS

TEST

SPECIFICATIONS

CONDITIONS

SERIES

Resistance range

1 k

Ω to 250 kΩ

TCR:

Tracking

± 1 ppm/°C typical (± 2 ppm/°C maximum)

- 55 °C to + 125 °C

Absolute

± 5 ppm/°C maximum

± 10 ppm/°C maximum

0 °C to + 70 °C

- 55 °C to + 155 °C

Tolerance:

Ratio

0.1 %, 0.05 %, 0.02 %, 0.01 %

Absolute

± 0.1 %, ± 0.5 %, ± 1 %

Power rating

125 mW at 25 °C/50 mW at + 70 °C, 25 mW at + 125 °C

Stability

300 ppm typical

2000 h at + 70 °C under Pn

Voltage coefficient

< 0.01 ppm/V

Working voltage

Operating temperature range

Storage temperature range

- 55 °C to + 155 °C

Noise

< - 35 dB typical

MIL-STD-202 Method 308

Thermal EMF

< 0.01 µV/°C

Shelf life stability

50 ppm

1 year