TDA2006 datasheet(8/12 Pages) STMICROELECTRONICS

8 / 12 page

Figure 17 : Bridge Amplifier Configuration with Split Power Supply (PO = 24W, VS =

± 12V)

PRACTICAL CONSIDERATIONS

Printed Circuit Board

The layout shown in Figure 14 should be adopted

by the designers. If different layout are used, the

ground points of input 1 and input 2 must be well

decoupled from ground of the output on which a

rather high current flows.

Assembly Suggestion

No electrical isolation is needed between the pack-

age and the heat-sink with single supply voltage

configuration.

Application Suggestion

The recommended values of the components are

the ones shown on application circuits of Figure 13.

Different values can be used. The table 1 can help

the designers.

Table 1

Component

Recommanded

Value

Purpose

Larger Than

Recommanded Value

Smaller Than

Recommanded Value

22 k

Ω

Closed Loop Gain Setting

Increase of Gain

Decrease of Gain (*)

680

Ω

Closed Loop Gain Setting

Decrease of Gain (*)

Increase of Gain

22 k

Ω

Non Inverting Input

Biasing

Increase of Input

Impedance

Decrease of Input

Impedance

Ω

Frequency Stability

Danger of Oscillation at

High Frequencies with

Inductive Loads

3R2

Upper Frequency Cut-off

Poor High Frequencies

Attenuation

Danger of Oscillation

2.2

µF

Input DC Decoupling

Increase of Low

Frequencies Cut-off

µF

Inverting Input DC

Decoupling

Increase of Low

Frequencies Cut-off

C3C4

0.1

µF

Supply Voltage by Pass

Danger of Oscillation

C5C6

100

µF

Supply Voltage by Pass

Danger of Oscillation

0.22

µF

Frequency Stability

Danger of Oscillation

πBR1

Upper Frequency Cut-off

Lower Bandwidth

Larger Bandwidth

D1D2

1N4001

To Protect the Device Against Output Voltage Spikes.

(*) Closed loop gain must be higher than 24dB.

TDA2006

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