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Document Number: 72505

S-70853–Rev. C, 30-Apr-07

Vishay Siliconix

DG3001/3002/3003

PACKAGE OUTLINE

MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH, 165 µm BUMP HEIGHT)

Notes (Unless Otherwise Specified):

a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.

b. Non-solder mask defined copper landing pad.

c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.

Notes:

a. Use millimeters as the primary measurement.

Notes:

a. Use millimeters as the primary measurement.

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-

nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability

Index-Bump A1

Note c

Top Side (Die Back)

XXX

3003

Recommended Land Pattern

0.5

0.5

6 x Ø 0.150

Note b

Solder Mask Ø

Silicon

Bump

Note a

b Diameter

32

1

A

B

e

D

e

A

S

S

E

EUTECTIC (Sn/Pb)

Dim

Inches

Min

Max

Min

Max

A

0.610

0.685

0.0240

0.0270

0.140

0.190

0.0055

0.0075

0.470

0.495

0.0185

0.0195

b

0.180

0.250

0.0071

0.0098

D

1.490

1.515

0.0587

0.0596

E

0.990

1.015

0.0390

0.0400

e

0.5 BASIC

0.0197 BASIC

S

0.245

0.258

0.0096

0.0101

LEAD (Pb)-FREE (Sn/Ag/Cu)

Dim

Inches

Min

Max

Min

Max

A

0.688

0.753

0.0271

0.0296

0.218

0.258

0.0086

0.0102

0.470

0.495

0.0185

0.0195

b

0.306

0.346

0.0120

0.0136

D

1.490

1.515

0.0587

0.0596

E

0.990

1.015

0.0390

0.0400

e

0.5 BASIC

0.0197 BASIC

S

0.245

0.258

0.0096

0.0102