Copyright

© ANPEC Electronics Corp.

Rev. A.2 - Jan., 2008

APW7136A/B/C

www.anpec.com.tw

2

Symbol

Parameter

Rating

Unit

VIN Supply Voltage (VIN to GND)

-0.3 ~ 7

V

FB, EN to GND Voltage

V

LX to GND Voltage

-0.3 ~ 38

V

OVP to GND Voltage

-0.3 ~ 38

V

Maximum Junction Temperature

150

°C

Storage Temperature Range

-65 ~ 150

°C

Maximum Lead Soldering Temperature, 10 seconds

260

°C

Note 1: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Symbol

Parameter

Rating

Unit

θ

JA

Junction to Ambient Thermal Resistance

SOT-23-6

250

°C/W

Note 2:

θ

soldered directly on the PCB.

Symbol

Parameter

Range

Unit

VIN Input Voltage

2.7~ 6

V

Converter Output Voltage

Up to 32

V

Input Capacitor

4.7 or higher

µF

Output Capacitor

0.68 or higher

µF

L1

Inductor

6.8 to 47

µH

Ambient Temperature

-40 to 85

°C

Junction Temperature

-40 to 125

°C

Note 3: Refer to the application circuit for further information.

Electrical Characteristics

APW7136A/B/C

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

SUPPLY VOLTAGE AND CURRENT

Input Voltage Range

2.7

-

6

V

70

100

130

µA

FB = GND, switching

-

1

2

mA

Input DC bias current

EN = GND

-

-

1

µA

UNDER VOLTAGE LOCKOUT

UVLO Threshold Voltage

2.0

2.2

2.4

V

UVLO Hysteresis Voltage

50

100

150

mV

(Refer to Figure 1 in the “Typical Application Circuits”. These specifications apply over V

noted. Typical values are at T