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MMG3003NT1 bảng dữ liệu(PDF) 13 Page - Freescale Semiconductor, Inc

tên linh kiện MMG3003NT1
Giải thích chi tiết về linh kiện  Heterojunction Bipolar Transistor Technology (InGaP HBT)
PDF  18 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MMG3003NT1 bảng dữ liệu(HTML) 13 Page - Freescale Semiconductor, Inc

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MMG3003NT1
13
RF Device Data
Freescale Semiconductor
1.7
5.33
3.48
0.58
1.27
0.86
3.86
0.64
7.62
2.49
2.54
1.27
0.305 diameter
Figure 29. Recommended Mounting Configuration
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Recommended Solder Stencil



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