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STPC0366BTC3 bảng dữ liệu(PDF) 45 Page - STMicroelectronics

tên linh kiện STPC0366BTC3
Giải thích chi tiết về linh kiện  PC Compatible Embeded Microprocessor
PDF  51 Pages
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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STPC0366BTC3 bảng dữ liệu(HTML) 45 Page - STMicroelectronics

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Issue 1.2
The PBGA Package also dissipates heat through
peripheral ground balls. When a heat sink is
placed on the device, heat is more uniformely
spread throughout the moulding increasing heat
dissipation through the peripheral ground balls.
The more via pads are connected to each ground
ball, the more heat is dissipated . The only limita-
tion is the risk of lossing routing channels.
Figure 6-5 shows a routing with a good trade off
between thermal dissipation and number of rout-
ing channels.
Figure 6-4. Optimum layout for central ground ball
Via to Ground layer
Pad for ground ball
Clearance = 6mil
diameter = 25 mil
hole diameter = 14 mil
Solder mask
diameter = 33 mil
External diameter = 37 mil
connections = 10 mil
Figure 6-5. Global ground layout for good thermal dissipation
Ground pad
Via to ground layer



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