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STPCI2GDY bảng dữ liệu(PDF) 72 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  X86 Core PC Compatible System-on-Chip for Terminals
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STPCI2GDY bảng dữ liệu(HTML) 72 Page - STMicroelectronics

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MECHANICAL DATA
72/111
Issue 1.0 - July 24, 2002
5.2. 516-PIN PACKAGE THERMAL DATA
516-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
The structure in shown in Figure 5-4.
Thermal dissipation options are illustrated in
Figure 5-5 and Figure 5-6.
Figure 5-4. 516-Pin PBGA Structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal Dissipation Without Heatsink
Ambient
Case
Junction
Board
Ambient
Ambient
Case
Junction
Board
Rca
Rjc
Rjb
Rba
66
125
8.5
Rja = 13 °C/W
Airflow = 0
Board dimensions:
The PBGA is centred on board
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Board temperature taken at the centre balls
Board



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