L6226Q

Thermal management

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Thermal management

In most applications the power dissipation in the IC is the main factor that sets the

maximum current that can be deliver by the device in a safe operating condition. Therefore,

it has to be taken into account very carefully. Besides the available space on the PCB, the

right package should be chosen considering the power dissipation. Heat sinking can be

achieved using copper on the PCB with proper area and thickness. For instance, using a

ground layer connected through 18 via holes (9 below the IC).