Package information

TN12, TS12 and TYNx12 Series

10/12

Figure 19.

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available

at: www.st.com.

Table 9.

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

4.30

4.60

0.169

0.181

A1

2.49

2.69

0.098

0.106

A2

0.03

0.23

0.001

0.009

B

0.70

0.93

0.027

0.037

B2

1.25

1.40

0.048 0.055

C

0.45

0.60

0.017

0.024

C2

1.21

1.36

0.047

0.054

D

8.95

9.35

0.352

0.368

E

10.00

10.28 0.393

0.405

G

4.88

5.28

0.192

0.208

L

15.00

15.85 0.590

0.624

L2

1.27

1.40

0.050

0.055

L3

1.40

1.75

0.055

0.069

R

0.40

0.016

V2

0°

8°

0°

8°

G

L

L3

L2

B

B2

E

2mm min.

FLAT ZONE

A

C2

D

R

A2

V2

C

A1

16.90

10.30

8.90

3.70

5.08

1.30