Package mechanical data

M48Z32V

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 8.

SO44 – 44-lead plastic, small package outline

Note:

Drawing is not to scale.

Table 13.

SO44 – 44-lead plastic, small package mechanical data

SOH-C

E

N

D

C

L

A1

α

1

H

A

CP

Be

A2

Symbol

mm

inch

Typ

Min

Max

Typ

Min

Max

A

3.05

0.120

A1

0.05

0.36

0.002

0.014

A2

2.34

2.69

0.092

0.106

B

0.36

0.46

0.014

0.018

C

0.15

0.32

0.006

0.012

D

17.71

18.49

0.697

0.728

E

8.23

8.89

0.324

0.350

e

0.81

–

–

0.032

–

–

H

11.51

12.70

0.453

0.500

L

0.41

1.27

0.016

0.050

a0°

8°

0°

8°

N44

44

CP

0.10

0.004