TS4990 datasheet(25/32 Pages) STMICROELECTRONICS

tên linh kiện	TS4990

Giải thích chi tiết về linh kiện	1.2 W audio power amplifier with active low standby mode

PDF	32 Pages

Scroll/Zoom	100%

nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

Trang chủ	http://www.st.com

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25 / 32 page

TS4990

Package information

25/32

Figure 67.

Package mechanical data for 9-bump flip-chip package

Figure 68.

Daisy chain mechanical data

The daisy chain sample features two-by-two pin connections. The schematics in Figure 68

illustrate the way pins connect to each other. This sample is used to test continuity on your

board. Your PCB needs to be designed the opposite way, so that pins that are unconnected

in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting

an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.

■ Die size: 1.60 x 1.60 mm ±30µm

■ Die height (including bumps): 600µm

■ Bump diameter: 315µm ±50µm

■ Bump diameter before reflow: 300µm ±10µm

■ Bump height: 250µm ±40µm

■ Die height: 350µm ±20µm

■ Pitch: 500µm ±50µm

■ Coplanarity: 50µm max

■ * Back coating height: 100µm ±10µm

* Optional

1.60 mm

0.5mm

∅ 0.25mm

1.60 mm

0.5mm

∅ 0.25mm

600µm

100µm

600µm

100µm

1.6mm

TS4990 bảng dữ liệu(PDF) 25 Page - STMicroelectronics