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LIS331DL bảng dữ liệu(PDF) 40 Page - STMicroelectronics

tên linh kiện LIS331DL
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
Trang chủ  http://www.st.com
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LIS331DL bảng dữ liệu(HTML) 40 Page - STMicroelectronics

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Package information
LIS331DL
40/42
9
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK® is an ST trademark.
ECOPACK® specifications are available at: www.st.com.
Figure 25.
LGA 16: Mechanical data and package dimensions
Dimensions
Ref.
mm
inch
Min. Typ. Max. Min.
Typ.
Max.
A1
1.000
0.0394
A2
0.7850.0309
A3
0.200
0.0079
D1
2.850
3.000
3.150 0.1122 0.1181 0.1240
E1
2.850
3.000
3.150 0.1122 0.1181 0.1240
L1
1.000
1.060
0.0394 0.0417
L2
2.000
2.060
0.07870.0811
N1
0.500
0.0197
N2
1.000
0.0394
M
0.040
0.100
0.160 0.0016 0.0039 0.0063
P1
0.875
0.0344
P2
1.275
0.0502
T1
0.2900.350
0.410 0.0114 0.0138 0.0161
T2
0.190
0.250
0.310 0.0075 0.0098 0.0122
d
0.150
0.0059
k
0.050
0.0020
LGA16 (3x3x1.0mm)
Land Grid Array Package
Outline and
7983231
mechanical data



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