ESDA14V2-4BF2

Ordering information scheme

5/8

3

Ordering information scheme

Figure 12.

Ordering information scheme

4

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

ESDA

14V2 - 4

B

Fx

ESD Array

Number of line

Package

Breakdown Voltage

Type

14V2 = 14.2 Volts min.

B = Bidirectional

4 = 4 lines

F = Flip Chip

x = 2: Lead-free, pitch = 500 µm, bump = 315 µm

Figure 13.

Flip Chip package mechanical data

1.12 mm ± 50µm

315µm ± 50

700µm ± 50

650µm ± 65

210 µm