Ordering information

ESDA14V2-4BF3

6/8

Figure 15.

Flip Chip tape and reel specifications

Note:

More information is available in the application notes:

AN2348:"400 µm Flip Chip: Package description and recommendations for use"

AN1751: EMI Filters: Recommendations and measurements

5

Ordering information

Figure 13.

Footprint

Figure 14.

Marking

220 µm recommended

220 µm recommended

260 µm maximum

Solder stencil opening:

Copper pad Diameter:

Solder mask opening:

300 µm minimum

x

y

x

w

z

w

Dot

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 ± 0.1

4 ± 0.1

Ø 1.5 ± 0.1

0.69 ± 0.05

1.04

Table 3.

Ordering information

Order code

Marking

Package

Weight

Base qty

Delivery mode

ESDA14V2-4BF3

EF

Flip Chip

1.10 mg

5000

Tape and reel 7”