TDA8133 datasheet(9/13 Pages) STMICROELECTRONICS

tên linh kiện	TDA8133

Giải thích chi tiết về linh kiện	5.1 V AND 8 V DUAL-VOLTAGE REGULATOR WITH DISABLE AND RESET FUNCTIONS

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TDA8133/D

POWER DISSIPATION AND LAYOUT INDICATIONS

The power is mainly dissipated by the two device buffers. It can be calculated by the equation:

P = (VIN1-VO1) x IO1 + (VIN2-VO2) x IO2

The following table lists the different RthJA values of these packages with or without a heat sink and

the corresponding maximum power dissipation assuming:

Maximum Ambient Temperature = 70° C

Maximum Junction Temperature = 140° C

Device

Heat Sink

RthJA in °C/W

PMAX in W

TDA8133

1.4

Yes

3.5

TDA8133D

56 to 40

1.25 to 1.75

Yes

2.2

Figure 7: Thermal Resistance (Junction-to-Ambient) of DIP16 Package without Heat Sink

Figure 8: Metal plate mounted near the TDA8133D for heat sinking

Copper area (cm²) (35 µm plus solder) Board is face-down

To optimize the thermal conductivity of the copper

layer and the exchanges with the air, the solder

must cover the maximum amount of this area.

Test Board with

“On Board” square heat sink area.

Top View

Bottom View

TDA8133 bảng dữ liệu(PDF) 9 Page - STMicroelectronics