HV895 datasheet(5/5 Pages) SUTEX

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HV895

Doc.# DSFP-HV895

NR031408

Die Dimensions

Bump

Description

VIN1

353.4

5201.7

VIN1 supplies the DC-DC converter. VIN2 supplies the rest of the IC. They must be tied together. To

minimize conducted EMI, bypass with a 2.2µF ceramic capacitor to ground close to the IC.

VIN2

675.4

2424.6

VDD

12.7

2891.0

Externally supplied reference voltage for the I2C logic levels. Connect to the I2C bus supply.

GND1

353.4

4397.6

GND1 is the ground for the for the DC-DC converter, while GND2 is for the rest of the IC. Connect both

to system ground.

GND2

-14.8

1844.0

SCL

12.7

1594.0

Serial clock for the I2C interface. The HV895 is a Fast Mode device (f

SCL ≤ 400kHz).

SDA

12.7

2171.2

Serial data for the I2C interface. The HV895 is a write-only device, with a single 8-bit command byte

(AMP, see page 4).

722.4

1006.6

High voltage DC output of the internal boost converter. Connect a 4.7nF, 100V ceramic capacitor to

ground close to the IC.

OUT1

666.3

0.0

Outputs of the H-bridge driver. The liquid lens connects between these two bumps. When disabled

(AMP = 00h), both of these outputs are held at ground.

OUT2

DUM1

3.9

5334.2

These bumps are for mechanical support only. Provide pads on the PCB for these solder bumps. No

electrical connections should be made to these bumps.

DUM2

702.9

5334.2

Bump Coordinates and Descriptions (XY coordinates reference center of bump and are in µm. Tolerance is ±15µm.)

Note:

All dimensions in µm

1000

–75

SDA

GND2

GND1

SCL

OUT1

OUT2

VIN2

VDD

100 ±25

500 ±25

124–137

VIN1

DUM1

DUM2

6000

–196

Orientation mark

this end, top side

Bottom View

Side View

442.8

143.3

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