| công cụ tìm kiếm bảng dữ liệu linh kiện điện tử |
|
STLA01 bảng dữ liệu(PDF) 8 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STLA01 bảng dữ liệu(HTML) 8 Page - STMicroelectronics |
|
8 / 16 page ![]() Application information STLA01 8/16 6 Application information The STLA01 is a single LED driver using a constant-current topology. It can deliver up to 80 mA of output current. If a 1% program resistor is connect from the PROG pin to the GND pin and the EN pin is higher than 0.92 V, the device will supply the LED with the programmed constant current. Putting the EN pin below 0.80 V results in no current flow into the LED diode. 6.1 VCC pin A positive input supply voltage provides power to the driver. VCC can range from 3.75 V to 6 V and should be bypassed with at least a 1 µF capacitor. In shutdown mode, the ILED = 0. 6.2 EN pin The enable input pin is used to shut down the device when the value of the pin is below 0.80 V. In shutdown condition, the device has less than 10 µA supply current. The enable pin has an internal pull down (REN). If unused, the pin should be tied to VCC. 6.3 Programming charge current The LED current is programmed using a single resistor from the PROG pin to ground. The LED current is 100 times the current out of the PROG pin. The program resistor and the led current are calculated using, in first approximation, the following equations: RPROG = 100 x (1.22 V / ILED) 6.4 Power dissipation A good thermal PCB layout is very important to maximize the available output current. The thermal path for the heat generated by the IC is from the die to the copper lead frame through the package leads and exposed pad to the PC board copper. The PC board copper acts as the heat sink. The copper pad footprints should be as wide as possible and expand to larger copper areas in order to spread and dissipate the heat to the surrounding ambient. Feed-through vias to inner or backside copper layers are also useful in improving the overall thermal performance of the device. Other heat sources on the board, not related to the device, must also be considered when designing a PC board layout because they will affect overall temperature rise and the maximum output current. |
|
|
Link URL |
| Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không? [ DONATE ] |
Alldatasheet là | Quảng cáo | Liên lạc với chúng tôi | Chính sách bảo mật | Liên kết đến bảng dữ liệu | Trao đổi link | Tìm kiếm theo nhà sản xuất All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |