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STL9NK30Z bảng dữ liệu(PDF) 2 Page - STMicroelectronics |
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STL9NK30Z bảng dữ liệu(HTML) 2 Page - STMicroelectronics |
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2 / 8 page ![]() STL9NK30Z 2/8 ABSOLUTE MAXIMUM RATINGS THERMAL DATA Note: 1. The value is rated according to Rthj-F. 2. When Mounted on FR-4 Board of 1inch2,2 oz Cu 3. Pulse width limited by safe operating area 4. ISD< 9A, di/dt<300A/µs, VDD<V(BR)DSS,TJ<TJMAX AVALANCHE CHARACTERISTICS GATE-SOURCE ZENER DIODE PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. Symbol Parameter Value Unit VDS Drain-source Voltage (VGS =0) 300 V VDGR Drain-gate Voltage (RGS =20kΩ) 300 V VGS Gate- source Voltage ± 30 V ID (2) Drain Current (continuous) at TC = 25°C (Steady State) Drain Current (continuous) at TC = 100°C 9 5.6 A A IDM (2) Drain Current (pulsed) 36 A PTOT (2) Total Dissipation at TC = 25°C (Steady State) 2.5 W PTOT (1) Total Dissipation at TC = 25°C (Steady State) 75 W Derating Factor (2) 0.6 W/°C VESD(G-S) Gate source ESD(HBM-C=100pF, R=1.5K Ω) 3000 V/ns dv/dt (4) Peak Diode Recovery voltage slope 4.5 V/ns Tstg Storage Temperature –55 to 150 °C Tj Max. Operating Junction Temperature Symbol Parameter Max. Unit Rthj-F Thermal Resistance Junction-Foot (Drain) 1.6 °C/W Rthj-amb (2) Thermal Resistance Junction-ambient 50 °C/W Symbol Parameter Max Value Unit IAR Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by Tj max) 9A EAS Single Pulse Avalanche Energy (starting Tj = 25 °C, ID =IAR,VDD =50 V) 155 mJ Symbol Parameter Test Conditions Min. Typ. Max. Unit BVGSO Gate-Source Breakdown Voltage Igs=± 1mA (Open Drain) 30 V |
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