L6210 datasheet(6/8 Pages) STMICROELECTRONICS

6 / 8 page

Package information

L6210

6/8

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 5.

PDIP 16 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

(*)“D” and “E1” dimensions do not include mold flash or protusions.

Mold flash or protusions shall not exceed 0.25mm.

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

5.330

0.2098

0.380

0.0150

2.920

3.300

4.950 0.1150 0.1299 0.1949

0.360

0.460

0.560 0.0142 0.0181 0.0220

1.140

1.520

1.780 0.0449 0.0598 0.0701

0.200

0.250

0.360 0.0079 0.0098 0.0142

D(*)

18.670 19.180 19.690 0.7350 0.7551 0.7752

7.620

7.870

8.260 0.3000 0.3098 0.3252

E1(*)

6.100

6.350

7.110 0.2402 0.2500 0.2799

2.540

0.1000

17.780

0.7000

7.620

0.3000

10.920

0.4299

2.920

3.300

3.810 0.1150 0.1299 0.1500

PDIP 16

0015895 E

0015895_E

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