ABSOLUTE MAXIMUM RATINGS

(1) (2)

DISSIPATION RATINGS

TLC5946

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PRODUCT

PACKAGE-LEAD

ORDERING NUMBER

TLC5946

TSSOP-28

TLC5946PW

TLC5946

HTSSOP-28 PowerPAD™

TLC5946PWP

TLC5946

5 mm × 5 mm QFN-32

TLC5946RHB

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

Over operating free-air temperature range, unless otherwise noted.

PARAMETER

TLC5946

UNIT

–0.3 to +6.0

V

OUT0 to OUT15

50

mA

Output current (dc)

XERR

6

mA

Input voltage range: SIN, SCLK, GSCLK, XLAT, BLANK, MODE, XHALF,

V

IREF

SOUT, XERR

V

Output voltage range

OUT0 to OUT15

–0.3 to +18

V

Operating temperature range: junction temperature

–40 to +150

°C

Storage temperature range

–55 to +150

°C

Human body model (HBM),

2

kV

JEDEC JESD22-A114

ESD rating

Charged device model (CDM),

500

V

JEDEC JESD22-C101

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

All voltage values are with respect to network ground terminal.

OPERATING FACTOR

PACKAGE

POWER RATING

POWER RATING

POWER RATING

TSSOP-28

16.21 mW/°C

2026 mW

1296 mW

1053 mW

HTSSOP-28 with

31.67 mW/°C

3958 mW

2533 mW

2058 mW

HTSSOP-28 with

16.21 mW/°C

2026 mW

1296 mW

1053 mW

27.86 mW/°C

3482 mW

2228 mW

1811 mW

(1)

With PowerPAD soldered onto copper area on printed circuit board (PCB); 2 oz. copper. For more information, see SLMA002 (available

for download at www.ti.com).

(2)

With PowerPAD not soldered onto copper area on PCB.

(3)

The package thermal impedance is calculated in accordance with JESD51-5.

2

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