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TXS0101DBVT bảng dữ liệu(PDF) 3 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
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TXS0101DBVT bảng dữ liệu(HTML) 3 Page - Texas Instruments

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ABSOLUTE MAXIMUM RATINGS
(1)
THERMAL IMPEDANCE RATINGS
TXS0101
www.ti.com ...................................................................................................................................................... SCES638A – OCTOBER 2007 – REVISED MAY 2008
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCCA
Supply voltage range
–0.5
4.6
V
VCCB
Supply voltage range
–0.5
6.5
V
A port
–0.5
4.6
VI
Input voltage range(2)
V
B port, OE
–0.5
6.5
A port
–0.5
4.6
Voltage range applied to any output
VO
V
in the high-impedance or power-off state(2)
B port
–0.5
6.5
A port
–0.5
VCCA + 0.5
VO
Voltage range applied to any output in the high or low state(2)(3)
V
B port
–0.5
VCCB + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCCA, VCCB, or GND
±100
mA
DBV package
165
DCK package
259
θ
JA
Package thermal impedance(4)
°C/W
DRL package
142
YZP package
123
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3)
The value of VCCA and VCCB are provided in the recommended operating conditions table.
(4)
The package thermal impedance is calculated in accordance with JESD 51-7.
UNIT
DBV package
165
DCK package
259
θ
JA
Package thermal impedance(1)
°C/W
DRL package
142
YEP/YZP package
123
(1)
The package thermal impedance is calculated in accordance with JESD 51-7.
Copyright © 2007–2008, Texas Instruments Incorporated
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