LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
1.T.Sol=230
℃±5℃
2.Dwell time=5
±1sec
Solderability Test
This test intended to see soldering well
performed or not.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
MIL-STD-883:1008
JIS C 7021: B-10
MIL-STD-202:103B
JIS C 7021: B-11
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
JIS C 7021: B-12
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
High Temperature
Storage Test
1.Ta=105
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Ta=-40
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
1.Ta=105
℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
1.Ta=65
℃±5℃
2.RH=90 %~95 %
3.t=240hrs
±2hrs
1.T.Sol=260
℃±5℃
2.Dwell time= 10
±1sec.
Thermal Shock Test
Solder Resistance
Test
High Temperature
High Humidity Test
Low Temperature
Storage Test
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
The purpose of this test is the resistance
of the device under tropical for hous.
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Test Condition
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Reliability Test:
Test Item
Operating Life Test
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
Description
Reference
Standard
PART NO. LA112B/VY.VG-4
Page 5/5
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